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Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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The company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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Draking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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Product Center
Dressing Board
Technical Specifications
Application Areas of Sharpening Plates
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Pre-cutting of new blades, blade sharpening during cutting |
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Suitable for hub-type wafer dicing blades (hard blades) and hubless dicing blades (soft blades) |