Jiangsu Zhuojin Semiconductor Technology Co., Ltd.
Customer Technical Requirements Survey Form (Wafer Dicing Blades)

Statement
1. This survey aims to understand your company's product information so that Jiangsu Zhuojin Semiconductor Technology Co., Ltd. (hereinafter referred to as "the Company" or "Zhuojin") can provide you with a suitable cutting solution.
2. The Company assumes responsibility for the confidentiality of the information you provide, and this information will not be used for other commercial purposes.
3. Thank you for your cooperation!

1. Customer Basic Information

Company Name

Customer Contact

Position/Department

Phone Number

Email

Sample delivery address

2. Material/Product

Material type

Material size/thickness

Is the product gold or silver backed?

Cutting kerf additional layer

Cutting kerf width

Die size

Brand and model of dicing blade in use

3. Current Processing Parameters

Equipment brand and model

Cutting method

Spindle

Spindle 1

Spindle 2

Spindle power

Blade model

Cutting height

Cutting width

Number of blade sharpenings/wear before cutting

Is the blade sharpened during cutting

Spindle speed (rpm)

Infeed speed (mm/s)

Water flow rate (L/min)

Film (model)

Spray nozzle type

Cutting protective liquid

Carbon dioxide foam resistance value

4. Requirements/Standards

Requirements/Standards

Current value

Required value

Weighting (1=highest, 5=lowest)

1) Chipping size (front)

2) Chipping size (back)

3) Chipping size (side)

4) Blade life (m/piece)

Submit
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