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Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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The company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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Draking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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Product Center
Hubless Blade
Technical Specifications
Application Fields of Electroplated Soft Blades
Semiconductor Slicing DicingBGA, LGA, LED chips, diodes |
Optical glassFilters, blue glass, crystal, gemstones and other hard and brittle materials |
CeramicsQuartz cover plates, ceramic substrates |
Metallic materialsHard alloys, tool steel, etc. |
Comprehensive Advantages
Effective problem-solving capabilities· Burr issues; · Blade life issues; · Chipping issues; · Good discharge. |
Product Features· Processing of ultra-thin, brittle materials, reducing burrs, grooving, high efficiency, long service life; · High wear resistance and cutting ability; · Strong abrasive bonding strength, high toughness, wide application range, strong adaptability. |
Short delivery cycle, good stability· Has a production capacity exceeding 30,000 pieces per month, stable quality; · Cutting life and product quality are comparable to leading brands in the industry. |
Quick response, professional service· New samples can be provided within one week for customer's new needs (size and specifications are unlimited); · Respond to customer exception handling within 24 hours. |