Wafer Dicing Services

 

Overview

Draking Semiconductor Technology started its chip packaging lapping and scribing business in 2023. The company has an 800-square-meter class 1000 cleanroom for lapping and scribing operations, equipped with a professional application technology team. Through professional teams, equipment, and consumables, it provides lapping and scribing processing services for packaging customers and IC design customers. Currently, it has established mature processes for wafer front-side film lamination, back-side thinning (polishing), wafer dicing, and processing of packaging bodies/ceramic substrates/glass/magnetic materials.

Processable Materials

(1) Silicon wafers: ESD, TVD, MOS, IGBT, IC, LED, etc.; (2) Compound semiconductors: Silicon carbide, lithium tantalate, lithium niobate, gallium nitride, etc.; (3) Others: QFN/DFN, ceramic substrates, quartz, glass, etc.

Equipment

The company boasts strong equipment capabilities. (1) Dicing saws: 20 dual-axis automatic dicing saws, models DISCO 6361/6340 and TSK 3000T; (2) Backgrinding machines: 2 high-configuration backgrinding machines, models DISCO 8761/8540, with complete auxiliary equipment.

Processing Capacity

The company's current monthly output is 60,000-80,000 wafers of various types, and there is capacity for 8-10 more machines to handle increased business.