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Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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The company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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Draking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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Solutions
Double-layer bonded thick chip
Committed to providing customers with high-quality domestic cutting, grinding, and polishing products and solutions!
Blade type:
DRHC-SD3000M-70-FF(Z1)
DRHC-SD3500M-70-FE(Z2)
DRHC-SD3500M-70-FE(Z2)
Wafer information
1. Wafer thickness: 920μm
2. Cutting channel width: 90μm
3. Die size: 4.05*2.01mm
Dicing process
1. Cutting mode: single cut
2. Cutting speed: 30mm/s
3. Cutting water flow rate: shower 1L/min，blade 1.5L/min
4. Dicing film model: D-485H
Effect diagram
