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Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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The company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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Draking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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Solutions
Aluminum nitride ceramic substrate
Committed to providing customers with high-quality domestic cutting, grinding, and polishing products and solutions!
Blade type:
Metal soft blade
DRMC-1A8 SD400M3-50
58*0.15*40
DRMC-1A8 SD400M3-50
58*0.15*40
Workpiece Information
1. Workpiece: 1100μm thick aluminum nitride ceramic substrate
2. Cutting width: 200μm
3. Die size: 3.495*3.488mm
Cutting Process
1. Cutting mode: One-cut-through
2. Cutting speed: 10mm/s
3. Cutting water flow: shower 1.5L/min，blade 1.5L/min
4. Cutting water temperature: 14~18℃
Effect diagram
