-
Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
-
-
The company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
-
Draking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
-
-
Solutions
QFN, DFN, and other packages
Committed to providing customers with high-quality domestic cutting, grinding, and polishing products and solutions!
Blade type:
Resin soft blade
DRRC-1A8 SD280 M1-75
58*0.3*40
DRRC-1A8 SD280 M1-75
58*0.3*40
Processing object information
1. Processing object: 520μm thick DFN
2. Cutting path width: 300μm
3. Die size: 1.3*1.3mm
Cutting process
1. Cutting mode: single cut
2. Cutting speed: 30mm/s
3. Cutting water flow rate: shower 1.5L/min，blade 1.5L/min
4. Cutting water temperature: 16~20℃
Effect diagram
