draking@drakingsemi.com

+86-19946171465

Draking Semiconductor Draking

Dedicated to becoming a leading domestic
1

DRAKING SEMI

Dedicated to becoming a leading domestic

substitute for packaging grinding consumables.

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Dedicated to becoming a leading domestic
1

DRAKING SEMI

Dedicated to becoming a leading domestic

substitute for packaging grinding consumables.

View More +
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DRAKING

SEMI

Since

2020

Jiangsu Draking Semiconductor Technology Co., Ltd.

Committed to becoming a leading domestic substitute for packaging and grinding consumables

Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies. We master core technologies and processes, providing customers with a complete cutting and grinding solution of "consumables + equipment" for "dicing + grinding" in the semiconductor packaging process.

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Product Center

Mastering core technologies and processes to provide customers with a complete cutting and grinding solution of "dicing + grinding" and "consumables + equipment" for the semiconductor packaging process

Electroformed Bond Hub Blades Hubless Blades

Technical Strength

Mastering core technologies and processes to provide customers with a complete cutting and grinding solution of "dicing + grinding" and "consumables + equipment" for the semiconductor packaging process

  • zhuojin
    Adhesive formula
    Adhesive formula
    There are many adhesive raw materials and complex ratios, and each formula requires more than half a year of continuous debugging. The company's technical team has mastered three process routes and over 20 adhesive formulas, which can meet the company's needs for developing hard and soft knives for different materials.
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  • zhuojin
    Electrochemical process
    Electrochemical process
    The electroplating technology mastered by the team can ensure that the thickness of the diamond blade reaches the maximum width of 10um, which can effectively shorten the pre cutting time; At the same time, the technology of reducing grain splashing and damage is adopted, which combines the characteristics of high processing quality and long service life.
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  • zhuojin
    Diamond dispersion and sorting technology
    Diamond dispersion and sorting technology
    We use excellent diamond dispersion technology to achieve uniform formation of diamond on the aluminum substrate surface during the electroplating process. For different cutting products, we screen and control the particle size, shape, distribution uniformity, and adhesive strength of diamond particles to varying degrees to meet special processing conditions such as difficult to cut materials, high speed, and deep cutting.
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  • zhuojin
    Production consistency control
    Production consistency control
    Implement strict production consistency control, monitoring and recording every link from raw material procurement, production process control to final product inspection. Thousand level cleanroom production, temperature and humidity are controlled within appropriate ranges. Use imported high-precision measuring equipment to accurately measure the size, shape, and material properties of the cutting blade.
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    • Precision machining technology
    The company imports precision machine tools and grinders from Japan, and independently programs and sets different processing programs, operation methods, and compensation amounts. Through precision cutting and high-precision grinding, it can achieve a processing accuracy of 1 μ m. Strictly control the concentricity and segment difference of the blade hub to ensure the consistency of key parameters and operational stability of the blade product.
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    Solutions

    Mastering core technologies and processes to provide customers with a complete cutting and grinding solution of "dicing + grinding" and "consumables + equipment" for the semiconductor packaging process

    Blog

    Mastering core technologies and processes to provide customers with a complete cutting and grinding solution of "dicing + grinding" and "consumables + equipment" for the semiconductor packaging process

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    Telephone

    Ms. Chen +86-19946171465
    Mr. Wang +86-19101627797

     

    Email

    draking@drakingsemi.com

     

    Address

    Building 2, Jinhui Technology Park, No. 3119, Mudanjiang West Road, Qidong City, Jiangsu Province, China.

    Copyright © Jiangsu Draking Semiconductor Technology Co., Ltd. All Rights reserved

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