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Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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The company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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Draking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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Thickened bonding sheet
Dicing saw model Electroplated soft blade-toothless Cutting process Cutting mode: single cut Spindle speed: 25,000-30,000 rpm Cutting speed: 1-5 mm/s Cutting water flow: shower 1L/min，blade 1.5L/min Cutting water temperature: 18~22℃
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- Details
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- Commodity name: Thickened bonding sheet
- Commodity ID: 电镀软刀-无锯齿
Dicing saw model Electroplated soft blade-toothless Cutting process Cutting mode: single cut Spindle speed: 25,000-30,000 rpm Cutting speed: 1-5 mm/s Cutting water flow: shower 1L/min，blade 1.5L/min Cutting water temperature: 18~22℃
Dicing blade model
Electroplated soft blade - toothlessCutting process
Cutting mode: single cut
Spindle speed: 25,000-30,000 rpm
Cutting speed: 1-5 mm/s
Cutting water flow rate: shower 1L/min，blade 1.5L/min
Cutting water temperature: 18~22℃Cutting result image
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