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Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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The company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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Draking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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QFN, DFN, and other packages
Dicing saw model Resin soft blade Cutting process Cutting mode: single cut Spindle speed: 22,000 rpm Cutting speed: 30 mm/s Cutting water flow rate: shower 1.5 L/min, blade 1.5 L/min Cutting water temperature: 16~20 ℃
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- Details
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- Commodity name: QFN, DFN, and other packages
- Commodity ID: 树脂软刀1
Dicing saw model Resin soft blade Cutting process Cutting mode: single cut Spindle speed: 22,000 rpm Cutting speed: 30 mm/s Cutting water flow rate: shower 1.5 L/min, blade 1.5 L/min Cutting water temperature: 16~20 ℃
Dicing saw model
Resin soft bladeCutting process
Cutting mode: single cut
Spindle speed: 22,000 rpm
Cutting speed: 30 mm/s
Cutting water flow rate: shower 1.5L/min，blade 1.5L/min
Cutting water temperature: 16~20℃
Cutting result image
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