The wafer dicing blade is an ideal tool for cutting materials such as wafers, ceramics, and glass. It is made of high-quality diamond through advanced material formulas and unique processes, thus resulting in stable and reliable product quality, high cutting efficiency, and low cutting costs. It is a very ideal cutting tool. The wafer dicing blade is mainly used for cutting hard and brittle materials and metal materials such as wafers, semiconductor packaging, EMC wire racks, ceramic thin plates, PCBs, sapphire glass, etc.
The wafer grinding wheel is an important tool used in semiconductor manufacturing processes, mainly for grinding and thinning silicon wafers to achieve specific accuracy and smoothness requirements. The wafer grinding wheel is a tool used to remove unevenness, damage, or impurities from the surface of silicon wafers. In the semiconductor manufacturing process, silicon wafers need to go through multiple steps, such as cutting, polishing, etc., and the wafer grinding wheel plays a key role in wafer thinning. With the wafer grinding wheel, we can accurately control the size and shape of the wafer. In the packaging and testing process, the design and material selection of grinding wheels are crucial for achieving specific size and shape requirements.
Silicon wafer dicing blade (1) Applicable material: Si (2) Characteristics: High precision, stability, long service life, adaptability to all mains...
SiC wafer dicing blade (1) Applicable material: SiC (2) Characteristics: High precision, stability, long service life, adaptability to all main...
GaN compound dicing blade (1)Applicable material: GaN (2)Characteristics: High precision, stability, long service life, adaptability to all mainst...
Established in September 2020, Jiangsu DrakingﾠSemiconductor Technology Co., Ltd. is a company specializing in semiconductor packaging and testing consumables, with globally leading research & development and production capabilities for wafer dicing blade and wafer grinding wheel. We have a professional team composed of experienced engineers and technical experts, constantly innovating and optimizing our products. We have production bases in Qidong City, Jiangsu Province, and sales and after-sales teams in Shanghai, Suzhou City, Zhejiang Province, Jinhua City, Zhejiang Province, Xi'an City, Shaanxi Province, and Shenzhen City, Guangdong Province.
We are a technology-based small and medium-sized enterprise (SME) in Jiangsu Province, with a leading technical team and advanced production equipment. We have passed ISO 9001 quality management system certification, and boast core patents, software copyrights, and a large amount of proprietary technology. Our products meet international standards and have been recognized by well-known customers in the industry.
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We have a professional team composed of experienced engineers and technical experts, committed to continuously innovating and optimizing our products to meet the constantly evolving market demands.
We understand that each customer's needs are unique, so we provide personalized customization services to tailor the most suitable cutting and grinding solutions to your requirements and specifications.
We adhere to a strict corporate governance system, advocate for the values of integrity and ethics, and promote compliance and transparency in operational management. We cultivate a strategic perspective and avoid short-sighted behaviors such as seeking quick success and self-interest at the expense of others.
We are committed to establishing long-term cooperative relationships with our customers. In addition to high-quality products, we also offer comprehensive after-sales service and technical support to ensure that our customers can receive the best experience and value when using our products.
