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About UsEstablished in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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TechnicalThe company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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SolutionsDraking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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Technical Team
Team Profile
The company is based on the core personnel of the R&D and process departments of world-leading companies; with senior R&D personnel in the domestic diamond industry, a systematic team from the mechanical and materials colleges of 985/211 universities, and senior packaging grinding process personnel as the core, a strong R&D and process team has been established, continuously improving in diamond powder material selection and dispersion, precision electrochemical processes, precision processing processes, and adhesive formulations.
Among them, the core R&D personnel have an average of more than 15 years of R&D experience in dicing and grinding consumables and equipment, and have experience in the full-process R&D and mass production of star products.
