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SiC wafer dicing blade
SiC wafer dicing blade

SiC wafer dicing blade

(1) Applicable material: SiC
(2) Characteristics: High precision, stability, long service life, adaptability to all mainstream dicing machines

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Application of wafer dicing blade
Application of wafer dicing blade
2023/07/21
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Tel: +86-755-23200509Email: draking@en.drakingsemi.comJinhui Sci-Tech Park, No. 3119 Mudanjiang West Road, Qidong City, Jiangsu Province, China
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© Jiangsu Draking Semiconductor Technology Co., Ltd.
Company Updates
SEMICON China 2023 held successfully
About Us
About UsCareersQualification and HonorsCompany culture
Service
Wafer dicing bladeWafer grinding wheel
Jinhui Sci-Tech Park, No. 3119 Mudanjiang West Road, Qidong City, Jiangsu Province, China
Email: draking@en.drakingsemi.com
Tel: +86-755-23200509
© Jiangsu Draking Semiconductor Technology Co., Ltd.