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About UsEstablished in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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TechnicalThe company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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SolutionsDraking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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Dicing saw model Resin soft blade Cutting process Cutting mode: single cut Spindle speed: 25,000 rpm Cutting speed: 5 mm/s Cutting water flow rate: shower 1.5 L/min, blade 1.5 L/min Cutting water temperature: 16~20℃
Alumina ceramic substrate
Dicing saw model Resin soft blade Cutting process Cutting mode: single cut Spindle speed: 22,000 rpm Cutting speed: 30 mm/s Cutting water flow rate: shower 1.5 L/min, blade 1.5 L/min Cutting water temperature: 16~20 ℃
QFN, DFN, and other packages
Dicing blade model Electroplated soft blade - with serrations Cutting process Cutting mode: single cut Spindle speed: 22,000 rpm Cutting speed: 30 mm/s Cutting water flow rate: shower 1.5L/min，blade 1.5L/min Cutting water temperature: 16~20℃
LED lamp beads
Dicing saw model Electroplated soft blade-toothless Cutting process Cutting mode: single cut Spindle speed: 25,000-30,000 rpm Cutting speed: 1-5 mm/s Cutting water flow: shower 1L/min，blade 1.5L/min Cutting water temperature: 18~22℃
Thickened bonding sheet