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About UsEstablished in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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TechnicalThe company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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SolutionsDraking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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Core Technology
Precision Machining Technology
The company imports precision machine tools and grinding machines from Japan, and independently programs and sets different processing programs, operating methods, and compensation amounts. Through precise cutting processing and high-gloss, high-precision grinding, a processing accuracy of 1 μm can be achieved.
Strictly control the concentricity and step difference of the dicing blade hub to ensure the consistency and operational stability of the key parameters of the blade product.
Adhesive Formulation
There are many adhesive raw materials and complex ratios. Each formula requires more than six months of continuous debugging.
The company's technical team has mastered three process routes and more than 20 adhesive formulations, which can meet the company's needs for developing hard and soft blades for different materials.
Electrochemical Process
The electroplating technology mastered by the team can ensure that the thickness of the diamond blade reaches the limit width of 10 μm, which can effectively shorten the pre-dicing time;
At the same time, the technology of reducing grain splashing and damage is adopted, which combines high processing quality and long service life.
Diamond Dispersion and Sorting Technology
We use good diamond dispersion technology to complete the uniform formation of diamonds on the aluminum substrate during the electroplating process.
For different cutting products, we screen and control the particle size, shape, distribution uniformity, and adhesive strength of diamond particles to different degrees to meet special processing conditions such as difficult-to-cut materials, high speed, and deep cutting.
Production Consistency Control
Implement strict production consistency control, monitoring and recording each link from raw material procurement, production process control to final product inspection.
Thousand-level cleanroom production, temperature and humidity are controlled within the appropriate range.
Use imported high-precision measuring equipment to accurately measure the size, shape, and material properties of the dicing blade.