The wafer dicing blade is an ideal tool for cutting materials such as wafers, ceramics, and glass. It is made of high-quality diamond through advanced material formulas and unique processes, resulting in stable and reliable product quality, high cutting efficiency, and low cutting costs. It is a very ideal cutting tool. The wafer dicing blade is mainly used for cutting hard and brittle materials and metal materials such as wafers, semiconductor packaging, EMC wire racks, ceramic thin plates, PCBs, sapphire glass, etc.