The wafer dicing blade is an ideal tool for cutting materials such as wafers, ceramics, and glass. It is made of high-quality diamond through advanced material formulas and unique processes, resulting in stable and reliable product quality, high cutting efficiency, and low cutting costs. It is a very ideal cutting tool. The wafer dicing blade is mainly used for cutting hard and brittle materials and metal materials such as wafers, semiconductor packaging, EMC wire racks, ceramic thin plates, PCBs, sapphire glass, etc.
The wafer dicing blade is an ideal tool for cutting materials such as wafers, ceramics, and glass. It is made of high-quality diamond through advanced material formulas and unique processes, resulting in stable and reliable product quality, high cutting efficiency, and low cutting costs. It is a very ideal cutting tool. The wafer dicing blade is mainly used for cutting hard and brittle materials and metal materials such as wafers, semiconductor packaging, EMC wire racks, ceramic thin plates, PCBs, sapphire glass, etc.
Precautions for using wafer dicing blade:
1.Before using a wafer dicing blade, it is necessary to select the specification of the grinding wheel according to the size and performance of the grinding wheel.
2.During use, first align the angle, pay attention to the spacing, and slowly push forward. Do not contact the two too hard to avoid damage.
3.Diamond is extremely hard and wear-resistant, avoid colliding with it and causing unnecessary losses.
Since wafer dicing blade is of superhard abrasive grinding wheel, it has predominant characteristics and advantages compared to general abrasive grinding wheels:
1.The hardness of diamond abrasives determines the main characteristics of diamond grinding wheels, which can efficiently grind those materials difficult to be machined, such as wafers, hard alloys, glass, ceramics, etc. Moreover, grinding tools have a long service life.
2. Diamond has high wear resistance, with less grinding wheel wear and longer service life. In grinding, slight change in the size, shape, and morphology of diamond abrasive particles is more suitable for high-precision machining and result in high production efficiency. The dicing blade is a tool that can achieve efficient and precision machining simultaneously.
3.The sharpened wafer dicing blade can maintain the micro edge of the abrasive particles for a long time, and its good cutting performance can ensure a small grinding force during the grinding process, thereby reducing grinding power and saving energy.
4.Diamond boast excellent thermal conductivity, which is conducive to the heat dissipation and avoiding defects such as workpiece burns, cracks, and peeling-off, greatly improving the surface processing quality of the workpiece.
